Sika to Sponsor Global Automotive Lightweight Materials Detroit 2016 Conference
July 26, 2016—Sika Automotive announced Monday that it will be the headline sponsor, a presenter and an exhibitor at the Global Automotive Lightweight Materials Detroit 2016 Conference to be held Aug. 23-25 at the COBO Center in Detroit.
Sika’s North American research scientist for body-in-white bulk, Dr. Christian Eyholzer, will be featured as a speaker for the event. Eyholzer will speak on composites and mixed-material bonding and present a survey of different lightweight vehicle architectures with a review of the bonding, sealing and reinforcing technologies for enabling these constructions. Eyholzer will also discuss key development characteristics of structural and semi-structural adhesive solutions for composite and mixed-material bonding.
Sika will feature products including SikaPower, SikaForce and Sikaflex, for lightweight material and mixed-material bonding; SikaReinforcer and Sika High Strength Bonding structural inserts for body structural reinforcements and acoustical technologies; and SikaBaffle and SikaDamp for noise control in lightweight and conventional vehicles.
More information can be found on the event website.